two stacked coats of SU-8 as described previously. This results in a total thickness of approximately 320 μm. Following completion of photolithography, the wafer was coated in trichloro(1H,1H,2H,2H perfluoro-octyl)silane for 30 minutes. Once completed, a 1 : 10 mixture of PDMS curing agent to PDMS monomer (Sylgard® 184) was dispensed onto the wafer. Due to the microplate design, the height of the wall separation was restricted to the skirt height of the microplate (approximately 2.5 mm). The PDMS mixture was degassed for approximately 2 hours. Entrained bubbles were removed using a pipettor. Once devoid of bubbles, the wafer with PDMS was cured at room temperature overnight. The plate was placed such that it remained level during curing to ensure that the PDMS thickness was uniform across the wafer, which improves the focusing on each individual well within the IN Cell analyzer. The following day, the dish was placed in a 65 °C oven to complete the curing process.
